Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1997-11-24
1999-02-16
Talbot, Brian K.
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427282, 1011271, 101129, B05D 512, B41M 112
Patent
active
058718087
ABSTRACT:
A method for preserving solder paste in the manufacturing of printed circuit board assemblies. In one embodiment, the method utilizes a preserving device which has a frame adapted to be positioned on a stencil plate of a solder paste stenciling machine and a cover coupled to the frame. The frame has a wall that is configured to substantially surround at least a portion of the solder paste on the stencil plate between printing cycles. In a preferred embodiment, the wall is configured to surround a working region on the stencil plate defined by the area on the stencil plate that the solder paste contacts during a printing cycle. The cover is coupled to the frame to form a protective compartment that substantially houses the solder paste between printing cycles. As a result, the preserving device restricts the airflow across the solder paste to protect the solder paste from environmental elements within the stenciling machine.
REFERENCES:
patent: 4704961 (1987-11-01), Jensen et al.
patent: 4784310 (1988-11-01), Metzger et al.
patent: 5273780 (1993-12-01), Borger et al.
patent: 5400914 (1995-03-01), Lin
patent: 5622108 (1997-04-01), Benedetto et al.
MCMS Inc.
Talbot Brian K.
LandOfFree
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