Etching a substrate: processes – Forming or treating electrical conductor article – Forming or treating of groove or through hole
Patent
1994-03-21
1995-08-29
Breneman, R. Bruce
Etching a substrate: processes
Forming or treating electrical conductor article
Forming or treating of groove or through hole
126 92, B23P 1500
Patent
active
054457084
ABSTRACT:
A method for preparing ultrathin piezoelectric resonator plates having an ultrathin vibrating portion enclosed by a thick periphery portion, comprising a forming process which forms a plurality of depressions in one side of a wafer of a piezoelectric material to form ultrathin vibrating portions as the bottom wall of each depression and a trimming process which trims the thickness of each vibrating portion by etching to adjust the resonance frequency, characterized by bonding a comparatively thick plate with a plurality of holes formed at the positions corresponding to the depressions in the wafer to the depressed side of the wafer or forming a layer with a plurality of holes formed at the positions corresponding to the depressions in the wafer over the depressed side of the wafer, and putting an etching liquid into the depressions through the holes in the thick plate or layer.
By this method, excessive or incomplete trimming in the trimming process can be prevented and hence the yield rate of product increases.
REFERENCES:
patent: 3694677 (1972-09-01), Guttwein
patent: 4502932 (1985-03-01), Kline
patent: 4631437 (1986-12-01), Ballato
patent: 5271798 (1993-12-01), Sandhu
Wolf "Silicon Processing for the VLSI Era" vol. 1, pp. 520 & 529., 1987 Lattice Press.
Breneman R. Bruce
Chang Joni Y.
Toyo Communication Equipment Co., Ltd.
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