Coating processes – Coating by vapor – gas – or smoke – Metal coating
Patent
1988-07-12
1989-09-26
Silverman, Stanley
Coating processes
Coating by vapor, gas, or smoke
Metal coating
427 96, 427 99, 427304, 427305, 427306, 427404, C23C 1600
Patent
active
048699306
ABSTRACT:
A process for preparing a substrate, e.g., an epoxy printed circuit board, for subsequent metallization. Active chemical sites are formed adhering to the substrate surface. The substrate is then exposed to a vapor of a volatile organometallic compound, which chemically reacts with the active sites and is decomposed to at least a species of the metal constituent of the compound. This species adheres to the substrate and can be transformed into the free metal which is useful as a seed for subsequent electroless deposition of a metal thereon. If selective deposition is desired, a resist masking layer is used prior to forming the seed layer. Volatile organopalladium compounds, such as (cyclopentadienyl)(allyl)palladium and bis(allyl)pallidium, are particularly effective for depositing a palladium seed which is particularly effective for electroless deposition of copper.
REFERENCES:
patent: 2888376 (1959-05-01), Drummond
patent: 3035944 (1962-05-01), Sher et al.
patent: 3086881 (1963-04-01), Jenkin
patent: 3188230 (1965-06-01), Bakish et al.
patent: 3294654 (1966-12-01), Norman et al.
patent: 3914515 (1975-10-01), Kane et al.
patent: 4297397 (1981-10-01), Feldstein
patent: 4325991 (1982-04-01), Donovan et al.
patent: 4582564 (1986-04-01), Shanefield et al.
patent: 4716050 (1987-12-01), Green et al.
"Metalizing Plastic Surfaces," by R. Ostwald and G. Voit, Chemical Abstracts, vol. 103, (1985), Abstract 103:55039v.
"Rendering Kapton or Other Polyimide Film Photo Sensitive to a Catalyst for the Deposition of Various Metals in Patterns," by A. Shirk and J. P. Redmond, Electric Phenomena, vol. 90, (1979), Abstract 90:79931u.
Clarke Thomas C.
Jung Dae Y.
Kovac Caroline A.
Park Jae M.
Thomas Richard R.
International Business Machines - Corporation
Morris Daniel P.
Silverman Stanley
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