Method for preparing substrate surfaces for electroless depositi

Details Method for preparing substrate surfaces for electroless depositi Method for preparing substrate surfaces for electroless depositi

1976-06-28

1978-01-03

Kendall, Ralph S.

Coating processes

Pretreatment, per se, or post-treatment, per se

427304, 427305, 427306, 427 97, 427 98, C23C 302

Patent

active

040668096

ABSTRACT:
A three step seeding process with a hot water rinse and bake includes first contacting the surface of a substrate with a stannous chloride sensitizing solution, followed by a hot water rinse to remove any excess stannous chloride. Next, a palladium chloride activator is used to interact with the stannous compounds to form an adherent layer of metallic palladium particles. Thereafter, the surface is subjected to a palladium chloride/stannous chloride/HCL seeder bath which deposits a final catalytic layer on the surface and drilled through holes to facilitate the electroless plating of a metal of the substrate. A subsequent baking at a temperature between 105.degree. C and 120.degree. C sets the seeder on the substrate surface and in the through holes in the substrate.

REFERENCES:
patent: 3698940 (1972-10-01), Mersereau et al.
patent: 3817774 (1974-06-01), Kuzmik
patent: 3969554 (1976-07-01), Zeblisky

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