Method for preparing semiconductor wafers

Details Method for preparing semiconductor wafers Method for preparing semiconductor wafers

1988-06-09

1990-01-30

Gallagher, John J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156276, 1563073, 156330, 156344, 4283139, 437226, 437249, 521 91, 523444, B32B 3100

Patent

active

048971413

ABSTRACT:
Profound improvements and advantages are realized in the process of cutting semiconductor ingots to provide wafers if the adhesive used to bond said ingot to a mounting or cutting beam contains hollow microspheres.

REFERENCES:
patent: 3652486 (1972-03-01), Young

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