Method for preparing of cerium oxide powder for chemical...

Chemistry of inorganic compounds – Treating mixture to obtain metal containing compound – Rare earth metal

Reexamination Certificate

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C423S263000, C051S296000, C051S309000

Reexamination Certificate

active

07867461

ABSTRACT:
The present invention relates to a method of preparing a cerium oxide powder for a CMP slurry and a method of preparing a CMP slurry using the same, and more particularly, to a method of preparing a cerium oxide powder for a CMP slurry and a method of preparing a CMP slurry using the same in which the specific surface area of the powder is increased by preparing a cerium precursor, and then decomposing and calcinating the prepared cerium precursor. The pore distribution is controlled to increase the chemical contact area between a polished film and a polishing material, thereby reducing polishing time while the physical strength of powder is decreased, which remarkably reduces scratches on a polished film.

REFERENCES:
patent: 6818030 (2004-11-01), Feng et al.
patent: 6887566 (2005-05-01), Hung et al.
patent: 10-106991 (1998-04-01), None
patent: 2005-126253 (2005-05-01), None
Hoshino, Tetsuya, et al., Mechanism of polishing of SiO2films by CeO2particles,Journal of Non-Crystalline Solids283 (2001) pp. 129-136.

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