Method for preparing low-concentration polyaluminosilicate micro

Details Method for preparing low-concentration polyaluminosilicate micro Method for preparing low-concentration polyaluminosilicate micro

1995-10-25

1997-07-15

Jones, Deborah

Chemistry of inorganic compounds

Silicon or compound thereof

Oxygen containing

2523131, 2523155, C01B 3326

Patent

active

056480555

ABSTRACT:
An improved method and apparatus for preparing low-concentration polyaluminosilicate microgels from a water soluble silicate and a strong acid in which the silicate and acid are mixed at a rate to produce a Reynolds number of at least 4000, the mixture is aged and then diluted to a silica concentration of not more than 1.0 wt. %. The method achieves reduced silica deposition during the preparation of the microgels.

REFERENCES:
patent: 2217466 (1940-10-01), Baylis
patent: 2234285 (1941-03-01), Schworm et al.
patent: 2310009 (1943-02-01), Baker et al.
patent: 2444774 (1948-07-01), Hay
patent: 2466842 (1949-04-01), Elston
patent: 2769785 (1956-11-01), Walker
patent: 4213950 (1980-07-01), Mahler
patent: 4554211 (1985-11-01), Akira et al.
patent: 4954220 (1990-09-01), Rushmere
patent: 5066420 (1991-11-01), Chevallier
patent: 5176891 (1993-01-01), Rushmere
Reynold C. Merrill, Activated Silica Sols In Water Treatment, 40, 1355-1359, Aug. 1948.
Reynold C. Merrikl, Activated Silica-A New Chemical Eng Tool, vol. 1, No. 1, 27-32, 1947, no month.
L.L. Klinger, Improvements In The Coagulation Of Surface Waters With Activated Silica, vol. 122, 40-50, Apr. 1946.

Affiliated with

Also associated with

Rating

Method for preparing low-concentration polyaluminosilicate micro does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for preparing low-concentration polyaluminosilicate micro, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for preparing low-concentration polyaluminosilicate micro will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1490771