Method for preparing large-size substrate

Details Method for preparing large-size substrate Method for preparing large-size substrate

2007-02-27

2007-02-27

Dang, Phuc T. (Department: 2818)

Semiconductor device manufacturing: process

Chemical etching

C438S680000, C365S237000

Reexamination Certificate

active

11059530

ABSTRACT:
A large-size substrate having improved flatness is prepared by measuring the flatness of one surface or opposite surfaces of a large-size substrate having a diagonal length of at least 500 mm, and partially removing raised portions on the one surface or opposite surfaces of the substrate by means of a processing tool on the basis of the measured data. The processing tool is adapted to blast a slurry of microparticulates in water carried on compressed air against the substrate.

REFERENCES:
patent: 5484325 (1996-01-01), Shank
patent: 5975996 (1999-11-01), Settles
patent: 2003/0143403 (2003-07-01), Shibano et al.
patent: 1 333 313 (2003-08-01), None
patent: 2003-292346 (2003-10-01), None

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