Method for preparing highly heat-conductive substrate and copper

Details Method for preparing highly heat-conductive substrate and copper Method for preparing highly heat-conductive substrate and copper

1985-01-29

1986-09-16

Lin, Kuang Y.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228121, B23K 3102

Patent

active

046117458

ABSTRACT:
A method for preparing a highly heat conductive substrate which comprises interposing an active layer with a thickness of 0.5 to 10 .mu.m comprising silver (Ag) and an active metal selected from the group consisting of titanium, zirconium and hafnium, and also copper (Cu) optionally, between an aluminium nitride (AlN) substrate and a copper member; and joining said aluminium nitride (AlN) substrate and said copper (Cu) member with each other by heating. A copper wiring sheet comprising the above active layer is also usable in the method.

REFERENCES:
patent: 3609471 (1971-09-01), Scace
Fischer et al., "Rapidly-Quenched Active Brazing Foils for Metal-Ceramic Bonding", presented at the 8th Annual Meeting of the American Ceramic Society, May 2-5th, 1982.

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