Method for preparing copper foil with insulating layer and...

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Reexamination Certificate

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Details

C156S307300, C156S324000, C427S372200, C427S385500

Reexamination Certificate

active

10250649

ABSTRACT:
To provide a method of manufacturing a material which can make a skeletal component as thin as possible to be contained in an insulating layer in a manufactured copper clad laminate and can securely prevent the direct contact between the nodular treatment surface of the attached copper foil and a skeletal component. In order to attain the object, here is adopted “a method of manufacturing a copper foil with an insulating layer1which method is a method of manufacturing a copper foil provided with a semi-cured insulating resin layer containing a skeletal component on one side surface of the copper foil, and is characterized in that: a first thermosetting resin layer3in an uncured or semi-cured state is provided on one side surface of a copper foil2; a nonwoven fabric5or a woven cloth5to be a skeletal component is press-bonded onto a first thermosetting resin layer3; a second thermosetting resin layer7is formed on a surface of a press-bonded nonwoven fabric5or woven cloth5; and a semi-cured insulating layer containing the nonwoven fabric5or the woven cloth5is formed on one side surface of the copper foil2by drying into a semi-cured state.”

REFERENCES:
patent: 4087300 (1978-05-01), Adler
patent: 4557784 (1985-12-01), Uekita et al.
patent: 4659425 (1987-04-01), Eggers et al.
patent: 4909886 (1990-03-01), Noguchi
patent: 5330595 (1994-07-01), Held
patent: 5633042 (1997-05-01), Nakamura et al.
patent: 5965245 (1999-10-01), Okano et al.
patent: 851724 (1998-07-01), None
patent: 6-196862 (1994-07-01), None
patent: 2001-88244 (2001-04-01), None
patent: 2001-316564 (2001-11-01), None
Webster's Dictionary definition “dry”.

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