Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2007-01-16
2007-01-16
Aftergut, Jeff H. (Department: 1733)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S307300, C156S324000, C427S372200, C427S385500
Reexamination Certificate
active
10250649
ABSTRACT:
To provide a method of manufacturing a material which can make a skeletal component as thin as possible to be contained in an insulating layer in a manufactured copper clad laminate and can securely prevent the direct contact between the nodular treatment surface of the attached copper foil and a skeletal component. In order to attain the object, here is adopted “a method of manufacturing a copper foil with an insulating layer1which method is a method of manufacturing a copper foil provided with a semi-cured insulating resin layer containing a skeletal component on one side surface of the copper foil, and is characterized in that: a first thermosetting resin layer3in an uncured or semi-cured state is provided on one side surface of a copper foil2; a nonwoven fabric5or a woven cloth5to be a skeletal component is press-bonded onto a first thermosetting resin layer3; a second thermosetting resin layer7is formed on a surface of a press-bonded nonwoven fabric5or woven cloth5; and a semi-cured insulating layer containing the nonwoven fabric5or the woven cloth5is formed on one side surface of the copper foil2by drying into a semi-cured state.”
REFERENCES:
patent: 4087300 (1978-05-01), Adler
patent: 4557784 (1985-12-01), Uekita et al.
patent: 4659425 (1987-04-01), Eggers et al.
patent: 4909886 (1990-03-01), Noguchi
patent: 5330595 (1994-07-01), Held
patent: 5633042 (1997-05-01), Nakamura et al.
patent: 5965245 (1999-10-01), Okano et al.
patent: 851724 (1998-07-01), None
patent: 6-196862 (1994-07-01), None
patent: 2001-88244 (2001-04-01), None
patent: 2001-316564 (2001-11-01), None
Webster's Dictionary definition “dry”.
Nagashima Noriyuki
Sato Tetsuro
Aftergut Jeff H.
Goff John L.
Mitsui Mining & Smelting Co. Ltd.
Rothwell Figg Ernst & Manbeck P.C.
LandOfFree
Method for preparing copper foil with insulating layer and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for preparing copper foil with insulating layer and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for preparing copper foil with insulating layer and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3749815