Method for preparing by thermal spraying a silicon-and...

Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C204S298130

Reexamination Certificate

active

07993503

ABSTRACT:
Method of producing a target by thermal spraying, especially by plasma spraying, said target comprising at least one compound based on atoms of different types chosen especially from the constituents M belonging to the (Zr, Mo, Ti, Nb, Ta, Hf, Cr) family and silicon, characterized in that at least one fraction of said compound, the constituents of which are bonded by covalent and/or ionic and/or metallic bonds, is injected into a plasma jet, said plasma jet spraying the constituents of said compound onto the target so as to deposit a coating of said compound on a surface portion of said target.

REFERENCES:
patent: 4619697 (1986-10-01), Hijikata et al.
patent: 5354446 (1994-10-01), Kida et al.
patent: 5377045 (1994-12-01), Wolfe et al.
patent: 5409517 (1995-04-01), Satou et al.
patent: 5418071 (1995-05-01), Satou et al.
patent: 5605609 (1997-02-01), Ando et al.
patent: 6146765 (2000-11-01), Mitsui et al.
patent: 6309593 (2001-10-01), Sato et al.
patent: 6432545 (2002-08-01), Schicht et al.
patent: 6605358 (2003-08-01), Stachowiak
patent: 6653027 (2003-11-01), Angelopoulos et al.
patent: 6787011 (2004-09-01), Ueda et al.
patent: 7090921 (2006-08-01), Stachowiak
patent: 7153578 (2006-12-01), Chonlamaitri et al.
patent: 7563488 (2009-07-01), De Bosscher et al.
patent: 7592068 (2009-09-01), Disteldorf et al.
patent: 2002/0119378 (2002-08-01), Angelopoulos et al.
patent: 2003/0103857 (2003-06-01), Heindel et al.
patent: 2005/0217988 (2005-10-01), Yoshikawa et al.
patent: 0 436 741 (1991-07-01), None
patent: 0 666 336 (1995-08-01), None
patent: 05-214525 (1993-08-01), None
P. Perez, et al., “Oxidation Behaviour of Al-Alloyed ZrSi2 at 700<0>C”, Intermetallics, vol. 8, No. 12, XP 004223358, pp. 1393-1398, 2000.
D. Pilloud, et al., “Structural Changes in Zr-Si-N Films vs. Their Silicon Content”, Surface and Coatings Technology, vol. 180-181, XP 002386022, pp. 352-356, 2004.
M. Nose, et al., “Microstructure and Mechanical Properties of Zr-Si-N Films Prepared by rf-Reactive Sputtering”, Journal of Vacuum Science and Technology A., vol. 20, No. 3, XP 012006073, pp. 823-828, 2002.
M. Zhou, et al., “Influence of Sputtering Conditions on Microstructure and Mechanical Properties of Zr-Si-N Films Prepared by Radio-Frequency-Reactive Sputtering”, Journal of Vacuum Science and Technology A., vol. 21, No. 5, XP 012006536, pp. 1791-1795, 2003.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for preparing by thermal spraying a silicon-and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for preparing by thermal spraying a silicon-and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for preparing by thermal spraying a silicon-and... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2644797

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.