Method for preparing binder-free clad powders

Details Method for preparing binder-free clad powders Method for preparing binder-free clad powders

1992-03-06

1994-12-13

Beck, Shrive

Coating processes

Particles, flakes, or granules coated or encapsulated

Inorganic base

427453, 427456, 427242, B05D 700

Patent

active

053728459

ABSTRACT:
A method of forming binderless clad powders using a high energy ball mill, preferably an attritor-type ball mill, is described. The binderless clad powders are formed by combining and processing a core material powder and a coating material (either a powder with significantly smaller particle size than the core material powder or a brittle material that will quickly form a powder with significantly smaller particle size than the core material powder) in a high energy ball mill for a relatively short time (generally less than one hour The processing time employed is such that the particle size of the core material powder is not significantly reduced but that the clad powders are formed. At least one of the two materials (i.e., core forming material or coating forming material) must be deformable within the high energy ball mill. Such binderless clad powders are suitable for use as thermal spray powders and which can be thermally sprayed to form coatings on a various substrates.

REFERENCES:
patent: 3591362 (1971-07-01), Benjamin
patent: 4101713 (1978-07-01), Hirsch et al.
patent: 4799955 (1989-01-01), McClellan
patent: 4818567 (1989-04-01), Kemp, Jr. et al.
patent: 4915987 (1990-04-01), Nara et al.
patent: 5070591 (1991-12-01), Quick et al.

Affiliated with

Also associated with

Rating

Method for preparing binder-free clad powders does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for preparing binder-free clad powders, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for preparing binder-free clad powders will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1192022