Method for preparing arylphosphonite antioxidant

Details Method for preparing arylphosphonite antioxidant Method for preparing arylphosphonite antioxidant

2006-09-12

2006-09-12

Le, Dung A. (Department: 4384)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

With attachment to temporary support or carrier

C438S460000, C438S113000, C438S459000, C438S508000

Reexamination Certificate

active

07105424

ABSTRACT:
A method for forming an underfill layer on a bumped wafer is disclosed. A film is provided wherein the film includes a base layer, a removable layer and the underfill layer. The film is disposed on a bump wafer and then pressing the film under heating is performed to have the bumps of the wafer embedded in the underfill layer. Then, the removable layer with base film attached thereto is removed, so the underfill layer well encloses the bumps of the wafer and is easily separated from the base film layer and the removable layer without damaging the bumps formed on the wafer.

REFERENCES:
patent: 6794751 (2004-09-01), Kumamoto
patent: 6841413 (2005-01-01), Liu et al.
patent: 2002/0001688 (2002-01-01), Ueda et al.
patent: 2003/0034128 (2003-02-01), Matsumura et al.
patent: 2004/0185601 (2004-09-01), Stepniak et al.

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