Method for preparing and using a screen printing stencil having

Printing – Stenciling – Stencils

Patent

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101129, 205 69, 205 75, 205127, 430308, B41C 114, C25D 110

Patent

active

053599284

ABSTRACT:
To prepare a screen printing stencil, a pattern of resist, having a complementary design to the final screen printing stencil, is applied to a conductive mandrel. A patterned layer is electroformed onto the exposed surface of the mandrel such that the layer corresponds to the exposed orifices of the pattern of resist. The resulting screen printing stencil has raised edges surrounding orifices. The raised edges are placed against a surface of a substrate to be printed in use of the stencil. The screen printing stencil can be used for printing substrates in the electronic substrate fabrication and electronic assembly industries.

REFERENCES:
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patent: 3763030 (1973-10-01), Zimmer
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patent: 4789425 (1988-12-01), Drake et al.
patent: 4915983 (1990-04-01), Lake et al.
Xerox Disclosure Journal, "A Double Exposure Technique for Positive Resist Lift-off", vol. 7, No. 4, Jul./Aug. 1982, pp. 293-294.
Electroplating, Frederick A. Lowenheim, McGraw Hill Book Co., Jan. 8, 1979, p. 147.
Metal Mask Specifications, Version 01, Process Lab Micron Co., Ltd., 1991.
From a catalogue of Process Lab. Micron Co., Ltd., a Japanese Corporation, date of publication of catalogue unknown.

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