Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Adhesive outermost layer
Reexamination Certificate
2005-06-24
2009-08-11
Lam, Cathy (Department: 1794)
Stock material or miscellaneous articles
Web or sheet containing structurally defined element or...
Adhesive outermost layer
C174S258000, C428S209000, C428S344000, C428S352000, C428S3550CN, C428S901000
Reexamination Certificate
active
07572503
ABSTRACT:
Directed to an insulating resin composition which comprises (A) a novolak epoxy resin having a biphenyl structure, (B) carboxylic acid-modified acrylonitrile butadiene rubber particles, (C) a triazine ring-containing cresol novolak phenolic resin, (D) a phenolic hydroxyl group-containing phosphorus compound, and (E) inorganic filler, an insulating film having a support using the same, a multilayer wiring board, and a process for producing a multilayer wiring board.
REFERENCES:
patent: 4762747 (1988-08-01), Liu et al.
patent: 5095077 (1992-03-01), Gardeski
patent: 5837155 (1998-11-01), Inagaki et al.
patent: 5874009 (1999-02-01), Inada et al.
patent: 5945222 (1999-08-01), Nagase et al.
patent: 6486242 (2002-11-01), Tobisawa et al.
patent: 6586526 (2003-07-01), Sekimoto et al.
patent: 699 07 123 (2004-04-01), None
patent: 69815601 (2004-04-01), None
patent: 1 103 575 (2001-05-01), None
patent: 1 013 684 (2003-04-01), None
patent: 1 312 638 (2003-05-01), None
patent: 0 893 474 (2003-06-01), None
patent: 8-302161 (1996-11-01), None
patent: 11-87927 (1999-03-01), None
patent: 2000-256537 (2000-09-01), None
patent: 2001-114871 (2001-04-01), None
patent: 2001-181399 (2001-07-01), None
patent: 2001-247657 (2001-09-01), None
patent: 2001-283639 (2001-10-01), None
patent: 2002-338806 (2002-11-01), None
patent: 2002-338887 (2002-11-01), None
patent: 2002-348353 (2002-12-01), None
Coombs, Clyde F. Jr, Printed Circuits Handbook, 1988, pp. 4.11-4.12, 6.3-6.5, 3rd Edition, McGraw Hill.
Translation of Office Action dated Apr. 22, 2005 in corresponding German application DE 10 2004 006 312.5.
Japanese Office Action issued in corresponding Japanese Patent Application No. 2003-039456, completed Oct. 28, 2008.
English translation of the Japanese Patent Office Action 2003-039456, completed Oct. 28, 2008.
Fujita Hiroaki
Fukai Hiroyuki
Kumakura Toshihisa
Morita Koji
Takanezawa Shin
Hitachi Chemical Co. Ltd.
Lam Cathy
LandOfFree
Method for preparing an insulating resin composition,... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for preparing an insulating resin composition,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for preparing an insulating resin composition,... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4129543