Method for preparing an electroplating bath and related...

Details Method for preparing an electroplating bath and related... Method for preparing an electroplating bath and related...

2005-03-29

2005-03-29

Mayekar, Kishor (Department: 1753)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Depositing predominantly single metal coating

C205S182000, C205S183000, C205S186000

Reexamination Certificate

active

06872295

ABSTRACT:
The present invention is related to a method for the preparation of a composition for electroplating a copper-containing layer on a substrate. This method makes use of an aqueous solution that has at least: a source of copper Cu(II) ions, an additive to adjust the pH to a predetermined value, and a complexing agent for complexing Cu(II) ions. The complexing agent has the chemical formula:in-line-formulae description="In-line Formulae" end="lead"?COOR1—COHR2R3in-line-formulae description="In-line Formulae" end="tail"?in which R1is an organic group covalently bound to the carboxylate group (COO), R2is either hydrogen or an organic group, and R3is either hydrogen or an organic group. The solution has no reducing agent. The method involves providing electrons from a source not in direct contact with the solution, through transport means that provides the contact between said source and said solution. The present invention is also related to a process for forming a copper-containing layer on a substrate in an electroplating bath prepared according to the foregoing method.

REFERENCES:
patent: 4673469 (1987-06-01), Beach et al.
patent: 5454930 (1995-10-01), Miura et al.
patent: 6398855 (2002-06-01), Palmans et al.
patent: 6585811 (2003-07-01), Palmans et al.
patent: WO 9947731 (1999-09-01), None
Hackh's Chemical Dictionary, 4thedition, 1969, p. 314.*
European Search Report; appln No. EP 00 87 0299; dated May 21, 2001.

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