Method for preparing a substrate for semiconductor devices

Details Method for preparing a substrate for semiconductor devices Method for preparing a substrate for semiconductor devices

1991-03-21

1992-10-06

Aftergut, Jeff H.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156281, 156257, 148DIG12, 148DIG135, 437974, B24B 100

Patent

active

051528576

ABSTRACT:
In a method for preparing a substrate for semiconductor device, the substrate is prepared either by directly bonding a bonding wafer to a base wafer or by bonding the bonding wafer to the base wafer with an oxide film formed on at least the bonding surface of the bonding wafer or the bonding surface of the base wafer to make finished semiconductor devices with an SOI structure. Prior to the bonding operation, the bonding wafer and the base wafer are subjected to the steps of (1) making the diameter of the bonding wafer smaller than the diameter of the base wafer, (2) setting the beveling width of the back side (bonding side) of the bonding wafer at 50 microns or less, and (3) beveling the front side of said base wafer so that the bonding surface of the base wafer is equal in size to the bonding surface of the bonding wafer. When the bonding wafer, which has been bonded to the base wafer, is subjected to polishing into a thin film, the peripheral portions of the bonding wafer form a smooth surface of the base wafer. This prevents the peripheral portions from chipping off.

REFERENCES:
patent: 4638552 (1987-01-01), Shimbo et al.
patent: 4671846 (1987-06-01), Shimbo et al.
patent: 4810318 (1989-03-01), Haisma et al.
patent: 4854986 (1989-08-01), Raby
patent: 4878957 (1989-11-01), Yamaguchi et al.
patent: 4883215 (1989-11-01), Goesele et al.
patent: 4939101 (1990-07-01), Black et al.
patent: 4983251 (1991-01-01), Haisma et al.
patent: 5032544 (1991-07-01), Ito et al.
patent: 5071785 (1991-12-01), Nakazato et al.
"Nikkei Microdevices", Nikkei-McGraw-Hill, Mar. 1, 1988, pp. 92-98.

Affiliated with

Also associated with

Rating

Method for preparing a substrate for semiconductor devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for preparing a substrate for semiconductor devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for preparing a substrate for semiconductor devices will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1186862