Method for preparing a substrate for a semiconductor package

Details Method for preparing a substrate for a semiconductor package Method for preparing a substrate for a semiconductor package

1996-02-28

1998-04-14

Niebling, John

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

205125, 427 98, 174257, H01L 2160

Patent

active

057390550

ABSTRACT:
A method for making a substrate for a semiconductor package comprising forming a conductive layer having a desired circuit pattern on the substrate; curing the conductive layer; and coining the cured conductive layer to make its surface uniform. The cured conductive layer may be plated with Ni, and subsequently with Au, and shaped to form a Au-plated board.

REFERENCES:
patent: 3520054 (1970-07-01), Pensack et al.
patent: 4569876 (1986-02-01), Nakakita
patent: 5073518 (1991-12-01), Doan et al.
patent: 5308792 (1994-05-01), Okabayashi et al.
patent: 5323520 (1994-06-01), Peters et al.
patent: 5380371 (1995-01-01), Murakami
patent: 5547902 (1996-08-01), Rohner
patent: 5565267 (1996-10-01), Capote et al.

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