Method for preparing a semiconductor wafer

Details Method for preparing a semiconductor wafer Method for preparing a semiconductor wafer

1992-02-26

1992-10-27

Kisliuk, Bruce M.

Abrasive tool making process, material, or composition

Impregnating or coating an abrasive tool

51281R, B24B 719

Patent

active

051578778

ABSTRACT:
A backing pad be used in a holding jig for holding a semiconductor wafer in the step of mirror polishing comprises a hydrophobic foam, possessed rigidity such that the difference between the thickness T.sub.1, thereof under a load of 300 gf/cm.sup.2 and the thickness, T.sub.2, thereof under a load of 1,800 gf/cm.sup.2 (T.sub.1 -T.sub.2) is in the range of from 1 to 100 .mu.m, and has holes formed therein in a diameter in the range of 10 to 30 .mu.m through the wafer-holding surface thereof.
The polishing of a semiconductor is effected by a method which comprises preparing a finished backing pad by the precision surface machining operation, setting the semiconductor wafer on a wafer holding jig having a template containing at least one wafer-positioning hole fixed on a carrier plate in such a manner that the backing pad enters the positioning hole, and polishing the semiconductor wafer.

REFERENCES:
patent: 5096854 (1992-03-01), Saito et al.

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