Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1986-09-05
1988-01-19
Czaja, Donald E.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156234, 156241, 156254, 427272, B44C 116, B32B 3100, B05D 132
Patent
active
047203153
ABSTRACT:
A method for the preparation of selectively decorated resin films comprises applying a first primer coat to the entire area of the base film, then applying either a masking coat alone or one or more color coats followed by the masking coat, the masking coat applied to an area of the base film that will define the final selective decoration. The masking coated surface is thereafter metalized and the resulting composite is joined to a mask-removing film bearing a pressure-sensitive adhesive having a limited peel strength known as "soft peel". The process is completed by the separation of the respective films, with the mask removing film withdrawing from the base film the unwanted portions of the metal coat and its underlying masking coat, to leave a crisp, patterned decoration.
The present process requires no solvents and is therefore environmentally preferred. In addition, the method may be easily and inexpensively practiced on a continuous basis and offers the reliable production of aesthetically superior decorations.
REFERENCES:
patent: 4012552 (1977-03-01), Watts
patent: 4454179 (1984-06-01), Bennett et al.
patent: 4473422 (1984-09-01), Parker et al.
patent: 4484970 (1984-11-01), Burzlaff et al.
Czaja Donald E.
Falasco Louis
Transfer Print Foils, Inc.
LandOfFree
Method for preparing a selectively decorated resin film does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for preparing a selectively decorated resin film, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for preparing a selectively decorated resin film will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-370613