Method for preparing a panel with a resinous frame

Details Method for preparing a panel with a resinous frame Method for preparing a panel with a resinous frame

1996-06-13

1998-08-18

Ball, Michael W.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156107, 15624418, 15624427, 26417717, 264252, B60J 1002, B60R 1306

Patent

active

057954216

ABSTRACT:
A shaped product for a frame which is extruded from a shaping die in a predetermined shape is pulled by a pulling device toward a pressing member to be passed through the pressing member. A panel which is held by an operating robot has a peripheral portion inserted into an inserting portion in the pressing member. The panel is moved so as to relatively move the pressing member with respect to the panel and along the peripheral portion thereof. The shaped product is passed through a hollow portion in the pressing member to be unified to the panel, thereby obtaining the panel with the frame wherein the frame has good appearance and the outer size of the panel with the frame is accurate.

REFERENCES:
patent: 2646378 (1953-07-01), Morin
patent: 3239402 (1966-03-01), Ecklund et al.
patent: 4844762 (1989-07-01), Schroder
patent: 5057265 (1991-10-01), Kunert et al.
patent: 5183522 (1993-02-01), Arima
patent: 5362428 (1994-11-01), Tsujino et al.
patent: 5445780 (1995-08-01), Yada e tal.
patent: 5478516 (1995-12-01), Malm et al.
patent: 5480504 (1996-01-01), Gold
patent: 5489409 (1996-02-01), Koganezawa et al.
patent: 5558828 (1996-09-01), Yada et al.

Affiliated with

Also associated with

Rating

Method for preparing a panel with a resinous frame does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for preparing a panel with a resinous frame, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for preparing a panel with a resinous frame will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1111484