Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate
2011-04-05
2011-04-05
Menz, Laura M (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Encapsulating
C438S106000, C361S824000
Reexamination Certificate
active
07919362
ABSTRACT:
A method for preparing a cover on a substrate in particular for the encapsulation of electronic, optical, optoelectronic components, of the electromechanical microsystems type, also known as Micro-Electro-Mechanical Systems (MEMS) or optoelectromechanical microsystems, also known as Micro-Opto-Elect-Mechanical systems (MOEMS), joined to the substrate.
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Commissariat a l''Energie Atomique
Menz Laura M
Nixon & Peabody LLP
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