Plastic and nonmetallic article shaping or treating: processes – Pore forming in situ – Composite article making
Patent
1995-06-14
1997-04-22
Kuhns, Allan R.
Plastic and nonmetallic article shaping or treating: processes
Pore forming in situ
Composite article making
264 469, 26427211, B29C 4420, B29C 4424
Patent
active
056226632
ABSTRACT:
This invention provides a continuous profile comprising a crosslinked foam matrix and a continuous filament embedded within the matrix. The profile is prepared by 1) extruding in an upward direction a composite consisting essentially of a foamable and crosslinkable composition containing a continuous filament, followed by 2) crosslinking and foaming the composition while the composition is in a substantially non-flowing state and supported by the filament.
REFERENCES:
patent: 2218385 (1940-10-01), Schulze
patent: 3900543 (1975-08-01), Davis
patent: 3903233 (1975-09-01), Dougherty
patent: 3914357 (1975-10-01), Cereijo et al.
patent: 3981649 (1976-09-01), Shimano et al.
patent: 4099897 (1978-07-01), Takano et al.
patent: 4107354 (1978-08-01), Wilkenloh et al.
patent: 4309160 (1982-01-01), Poutanen et al.
patent: 4333898 (1982-06-01), Schmidtchen
patent: 4354989 (1982-10-01), Beach
patent: 4468435 (1984-08-01), Shimba et al.
patent: 4547328 (1985-10-01), Yuto et al.
patent: 5156715 (1992-10-01), Starnes, Jr.
patent: 5391335 (1995-02-01), Sakamoto et al.
patent: 5468314 (1995-11-01), McGregor et al.
Kemp Daniel N.
Schnettler Dennis M.
Wieck Ronald W.
Dow Corning Corporation
Kuhns Allan R.
McKellar Robert L.
LandOfFree
Method for preparing a continuous foam profile containing a fila does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for preparing a continuous foam profile containing a fila, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for preparing a continuous foam profile containing a fila will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-339456