Method for preparation of alkoxysilanes having reduced halide co

Details Method for preparation of alkoxysilanes having reduced halide co Method for preparation of alkoxysilanes having reduced halide co

1998-07-01

1999-06-22

Shaver, Paul F.

Organic compounds -- part of the class 532-570 series

Organic compounds

Silicon containing

C07F 708

Patent

active

059144211

ABSTRACT:
A method of preparing an alkoxysilane having reduced halide content. The method comprises contacting a mixture comprising an alkoxysilane and residual halide with a mixture comprising about 1.5 to 15 moles of an alkyl alcohol per mole of residual halide, the alkyl alcohol comprising 1 to about 4 carbon atoms and about 0.1 to 5 moles of an orthoformate per mole of residual halide, to form a mixture comprising additional alkoxysilane and lower boiling species, and separating the lower boiling species and the alkoxysilane. Remaining residual halide may be contacted alkali metal to further reduce the halide content. Alkoxysilanes are useful as catalyst modifiers to manufacture polypropylene.

REFERENCES:
patent: 2698861 (1955-01-01), Shorr
patent: 4281146 (1981-07-01), Ashby
patent: 4697027 (1987-09-01), Sugihara et al.
patent: 4732996 (1988-03-01), Moorhead et al.
patent: 4827008 (1989-05-01), Gousetis et al.
patent: 5084588 (1992-01-01), Ocheltree et al.
patent: 5104999 (1992-04-01), Satoh
patent: 5210254 (1993-05-01), Ritscher et al.
patent: 5247117 (1993-09-01), Yamazaki et al.
patent: 5260470 (1993-11-01), Goebel et al.

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