Method for predetermining peel strength at copper/aluminum inter

Details Method for predetermining peel strength at copper/aluminum inter Method for predetermining peel strength at copper/aluminum inter

1983-01-21

1984-01-24

Silverberg, Sam

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

156233, 156231, 4273839, 427250, 164 46, B05D 512

Patent

active

044277164

ABSTRACT:
A method is disclosed for predetermining the magnitude of the average release peel strength at the interface between a vapor deposited copper film and a flexible aluminum carrier sheet to which the copper has been previously directly applied. The resulting copper-to-aluminum adherence is due to the formation of a preferential diffusion bond.

REFERENCES:
patent: 3969199 (1976-07-01), Berdan et al.
patent: 3984598 (1976-10-01), Sarazin et al.
patent: 4357395 (1982-11-01), Lifshin
"Lattice and Grain Boundary Diffusion of Copper in Thin Aluminum Films" by Chamberlain, et al. [Thin Solid Films, 45 (1977), pp. 189-194].
"Effect of Surface Contamination on Solid Phase Welding--An Overview" by J. L. Jellison [Surface Contamination edited by K. L. Mittal, vol. 2, Plenum Press (1979)].

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