Method for precision shaping of wafer materials

Details Method for precision shaping of wafer materials Method for precision shaping of wafer materials

1980-07-01

1982-08-17

Whitehead, Harold D.

Abrasive tool making process, material, or composition

Impregnating or coating an abrasive tool

B24B 100

Patent

active

043442609

ABSTRACT:
The invention provides a novel and efficient apparatus for shaping wafer materials of exact dimensions from a single crystal rod. Different from the conventional procedure, the single crystal rod is first ground to have a cross section larger than the desired wafer by a margin to grind and then sliced into margined wafers and the margined wafer is subjected to contour grinding tracing a prototype of the desired wafer. The invention also provides an apparatus for the above process, with which the margined wafer can be not only ground to the exact diameter and outer shape but also chamfered at the peripheral edges successively by a single mounting on the apparatus.

REFERENCES:
patent: 2693063 (1954-11-01), Dillon
patent: 3628294 (1971-12-01), Sattler
patent: 4084354 (1978-04-01), Grandia

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