Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2007-10-15
2009-11-10
Mulpuri, Savitri (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C138S107000, C138S108000, C138S109000, C138S110000, C138S125000, C257SE21499, C257SE21500, C257SE21505, C257SE21506, C257SE21508
Reexamination Certificate
active
07615405
ABSTRACT:
An electronic dive and method of fabricating an electronic device. The method including placing a placement guide over a top surface of a module substrate, the placement guide having a guide opening, the guide opening extending from a top surface of the placement guide to a bottom surface of the placement guide; aligning the placement guide to an integrated circuit chip position on the module substrate; fixing the placement guide to the module substrate; placing an integrated circuit chip in the guide opening, sidewalls of the placement guide opening constraining electrically conductive bonding structures on bottom surface of the integrated circuit chip to self-align to an electrically conductive module substrate contact pad on the top surface of the module substrate in the integrated circuit chip position; and bonding the bonding structures to the module substrate contact pads, the bonding structures and the module substrate contact pads in direct physical and electrical contact after the bonding.
REFERENCES:
patent: 6569710 (2003-05-01), Pierson
patent: 2003/0230801 (2003-12-01), Jiang et al.
patent: 2006/0027934 (2006-02-01), Edelstein et al.
patent: 2008/0036084 (2008-02-01), Buchwalter et al.
Andry Paul Stephen
Buchwalter Leena Paivikki
Horton Raymond R.
Knickerbocker John Ulrich
Tsang Cornelia K.
Ahmadi Mohsen
Alexanian Vazken
International Business Machines - Corporation
Mulpuri Savitri
Schmeiser Olsen & Watts
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