Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2007-10-16
2007-10-16
Malsawma, Lex (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C257S723000
Reexamination Certificate
active
11385121
ABSTRACT:
An electronic dive and method of fabricating an electronic device. The method including placing a placement guide over a top surface of a module substrate, the placement guide having a guide opening, the guide opening extending from a top surface of the placement guide to a bottom surface of the placement guide; aligning the placement guide to an integrated circuit chip position on the module substrate; fixing the placement guide to the module substrate; placing an integrated circuit chip in the guide opening, sidewalls of the placement guide opening constraining electrically conductive bonding structures on bottom surface of the integrated circuit chip to self-align to an electrically conductive module substrate contact pad on the top surface of the module substrate in the integrated circuit chip position; and bonding the bonding structures to the module substrate contact pads, the bonding structures and the module substrate contact pads in direct physical and electrical contact after the bonding.
REFERENCES:
patent: 6569710 (2003-05-01), Pierson
patent: 2003/0230801 (2003-12-01), Jiang et al.
Andry Paul Stephen
Buchwalter Leena Paivikki
Horton Raymond R.
Knickerbocker John Ulrich
Tsang Cornelia K.
Alexanian Vazken
Malsawma Lex
Schmeiser Olsen & Watts
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