Method for precise placement of an array of single particles on

Details Method for precise placement of an array of single particles on Method for precise placement of an array of single particles on

1998-02-04

2000-11-07

Parker, Fred J.

Coating processes

Direct application of electrical, magnetic, wave, or...

Pretreatment of substrate or post-treatment of coated substrate

427180, 427199, 427204, 427205, 427346, 427475, B05D 112

Patent

active

061433748

ABSTRACT:
Methods and apparatus are disclosed for efficiently and precisely adhering and centering particles on tacky areas on a surface containing an array of tacky and non-tacky areas. These methods and apparatus for particle attachment and centering involve holding and heating of the surface containing an array of tacky and non-tacky areas with particles adhered thereon for a period of time and at a temperature to allow the particles to adhere and center to the tacky areas. The surface containing the array of tacky and non-tacky areas can be heated either prior to, during or after a step of contacting the array with particles. Either discrete sheets or a continuous moving web of material having a surface containing an array of tacky and non-tacky areas can be employed. Each tacky area of an array of tacky and non-tacky areas has a size and bonding strength suitable for adhesion of one particle thereto in formation of an array. The array is populated with conductive-particles, is useful in the precise placement of particles on contact pads of electronic devices, such as circuit boards in semiconductor applications.

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patent: 5616206 (1997-04-01), Sakatsu et al.
patent: 5687901 (1997-11-01), Hoshiba et al.

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