Method for pre-shaping a semiconductor substrate for polishing a

Details Method for pre-shaping a semiconductor substrate for polishing a Method for pre-shaping a semiconductor substrate for polishing a

1995-08-07

1999-10-19

Breneman, R. Bruce

Semiconductor device manufacturing: process

Chemical etching

Liquid phase etching

438753, 438974, 216 38, 216 83, 216 91, 216 99, H01L 21302

Patent

active

059688491

ABSTRACT:
A method for pre-shaping a major surface (21,22) of a semiconductor wafer (20) in preparation for polishing includes shaping the major surface (21,22) so that it has a concave shape. In a preferred method, an etching process is used to form the concave shape. The concave shape provides a starting wafer that is extremely flat after polishing.

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Kaufmann et al. "Control of Etchant Temperature" IBM Tech. Discl. Bull. vol. 12 No. 10, p. 1678; Mar. 1970.
Hamaguchi "Chemical Etching of Silicon Wafer" pp. 129-134; May 1985.

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