Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2005-12-27
2005-12-27
Arbes, Carl J. (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S825000, C029S833000, C029S840000
Reexamination Certificate
active
06978540
ABSTRACT:
A method for utilizing one or more pre-formed underfill compositions in the application of surface mount components, most commonly chip scale packages (CSP's), to substrates for use in electronic devices. The pre-formed underfill of the invention is applied directly to the top and/or sides of the CSP before the reflow process and softens during reflow to flow across the circuit/board gap. One underfill composition utilized for this method comprises a thermoplastic film system that provides a coating on the component that is smooth and non-tacky. The film may be applied selectively to parts of the CSP such that it overhangs the top of the component and upon reflow flows over the edge of the CSP to form a connection with the substrate. A second pre-applied underfill composition or solder paste may be applied as an adhesive to provide sufficient tack in order to hold the electronic assembly together during the assembly process and to serve as a flux to facilitate solder wetting.
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Katze Douglas
Morganelli Paul
Peard David
Shah Jayesh
Almer Charles W.
National Starch and Chemical Investment Holding Corporation
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