Method for potting and encapsulating electronic circuits

Details Method for potting and encapsulating electronic circuits Method for potting and encapsulating electronic circuits

1979-10-04

1981-10-06

Lowe, James B.

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

To produce composite, plural part or multilayered article

26433112, B29D 602

Patent

active

042935199

ABSTRACT:
A method for potting and encapsulating electronic circuits by providing a homogeneous mixture of uncured thermosetting resin and curing agent in a flowable powder form with a particle size in the range of approximately 60 mesh to 200 mesh and curable in a range of approximately 125.degree. F. to 212.degree. F., and hollow microspheres having a diameter in the range of approximately 5 microns to 300 microns, intermixing the resin-curing agent and microspheres in a ratio in the range of approximately 35 percent to 45 percent resin-curing agent to microspheres by weight, enclosing the electronic circuit with a form, pouring the homogeneous mixture in the form to surround one electronic circuit, and heating the mixture to the required temperature for curing.

REFERENCES:
patent: 3533985 (1970-10-01), Lantz et al.
patent: 3670091 (1972-06-01), Frantz et al.
patent: 3849187 (1974-11-01), Fetscher
patent: 3864426 (1975-02-01), Salensky
"Embedding Processes and Materials", C. A. Harper, Machine Design, Jun. 9, 1966, pp. 150-173.

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