Method for positioning and bonding a solid body to a support bas

Details Method for positioning and bonding a solid body to a support bas Method for positioning and bonding a solid body to a support bas

1986-04-24

1988-05-03

Cashion, Jr., Merrell C.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

1562735, 1562737, 1562739, 1562744, 1562748, 1562755, 1562757, 156293, 156297, 156320, 156322, 228127, 350 9617, 350 962, B29C 6502, B29C 6504, B29C 6514, B29C 6518

Patent

active

047417960

ABSTRACT:
A method and arrangement for the positioning and bonding of a solid body (2), in which one part of the solid body (2) together with the bonding agent (6) is to be attached to a further element (7) and bonded to a base (4) is to be capable of positioning the solid body (2), at the point attained from positioning, with both high precision and high long term stability. The solid body (2) is immersed in the bonding agent (6) and this bonding agent is in turn located in a groove of a further electrically conducting body (7). The further body (7) is heated by current flow to a temperature at which the solid body (2) is movable within the bonding agent. Upon attaining the desired positioning of the solid body (2), the bonding agent is allowed to cool through controlled reduction of the heating current until solidification occurs.

REFERENCES:
patent: 2388242 (1945-11-01), Arndt
patent: 3397278 (1968-08-01), Pomerantz
patent: 4119363 (1978-10-01), Camlibel
patent: 4303304 (1981-12-01), Ruiz
patent: 4357072 (1982-11-01), Goodfellow
patent: 4382113 (1983-05-01), Schwartz
patent: 4479698 (1984-10-01), Landis

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