Method for populating a substrate with electronic components

Details Method for populating a substrate with electronic components Method for populating a substrate with electronic components

2006-07-04

2006-07-04

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S833000, C029S840000, C198S345300

Reexamination Certificate

active

07069647

ABSTRACT:
A novel method and placement system are configured for populating a substrate with an electronic component. The placement system has a substrate holding device for receiving the substrate, a wafer holding device above the substrate holding device serving for receiving a wafer holding frame, and a vacuum forceps holding device arranged above the wafer holding device. The wafer holding frame can receive a complete semiconductor wafer divided into electronic components.

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