Method for polishing workpieces and apparatus therefor

Abrading – Abrading process – Combined abrading

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451285, 451287, B24B 100

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059891076

ABSTRACT:
A polishing method and a compact apparatus for the method are presented for efficient production of a polished workpiece for manufacturing high technology devices. The polishing method comprises a first and second steps for polishing a work surface. In the first polishing step, the work surface is pressed against an abrading surface of a first polishing tool which is being rotated. In the second step, the work surface is pressed against a rubbing surface of a second polishing tool which is being moved in a planar translation motion relatively to the work surface.

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U.S. Patent Application Serial No. 08/697,167, filed Aug. 20, 1996, entitled "Polishing Apparatus", by Tetsuji Togawa et al., located in Group Art Unit 3203.

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