Method for polishing surface of transparent substrate layer of c

Details Method for polishing surface of transparent substrate layer of c Method for polishing surface of transparent substrate layer of c

1992-07-16

1994-09-20

Rachuba, M.

Abrading

Abrading process

Utilizing shield

451 38, B24B 100

Patent

active

053477669

ABSTRACT:
The present invention provides a method for polishing the surface of the transparent substrate layer of a color filter unit comprising a transparent substrate layer, a color filter layer, a protective film layer and a transparent electrode layer, which method comprises attaching, to the surface of the transparent electrode layer, a pressure-sensitive tape consisting of a base film layer and a pressure-sensitive adhesive layer giving substantially no staining to said surface of the transparent electrode layer, formed on one surface of the base film layer, as well as a pressure-sensitive tape used in the method. When the surface of the transparent substrate layer is polished according to the present method, there occurs no breakage of the color filter unit. Further, there occurs no staining of the surface of the transparent electrode layer owing to the adhesion of residual pressure-sensitive adhesive, abrasive, polishing refuse, etc. Consequently, a color filter unit giving a good image clearness can be obtained at high productivity.

REFERENCES:
patent: 4801490 (1989-01-01), Schuette

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