Method for polishing slight area of surface of workpiece and too

Abrading – Abrading process – Utilizing fluent abradant

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451165, 451 1, B24B 100

Patent

active

054046807

ABSTRACT:
A method for polishing a slight region of the surface of a workpiece utilizes an actuator or actuators having piezoelectric elements. The actuators cause slight movement of a polishing portion disposed at the leading end of a polishing tool in an XY-direction parallel with the surface of the workpiece and/or a Z-direction perpendicular to the surface of the workpiece. A polishing material, including a magnetic fluid and nonmagnetic abrasive grains dispersed in the magnetic fluid, is held magnetically in a space between the polishing portion and the workpiece.

REFERENCES:
patent: 2834158 (1955-01-01), Petermann
patent: 3427480 (1966-06-01), Robinson
patent: 3482360 (1969-12-01), Legge
patent: 4821466 (1989-04-01), Kato et al.
patent: 4934103 (1990-06-01), Campergue et al.
patent: 4977707 (1990-12-01), Chachin et al.
patent: 5054244 (1991-10-01), Takamatsu et al.
patent: 5076026 (1991-12-01), Mizuguchi et al.
patent: 5185957 (1993-02-01), Mizuguchi et al.

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