Method for polishing semiconductor wafers with montmorillonite s

Details Method for polishing semiconductor wafers with montmorillonite s Method for polishing semiconductor wafers with montmorillonite s

1985-01-14

1985-10-29

Schmidt, Frederick R.

Abrasive tool making process, material, or composition

Impregnating or coating an abrasive tool

51308, 106 3, B24B 100

Patent

active

045493740

ABSTRACT:
Semiconductor wafers are polished with an abrasive slurry which is prepared by dispersing montmorillonite clay in deionized water. The pH of the slurry is adjusted to 9.5 to 12.5 by adding alkali such as NaOH and KOH.

REFERENCES:
patent: 3420681 (1969-01-01), Karrip
patent: 3715842 (1973-02-01), Tredinnick et al.
patent: 3922393 (1975-11-01), Sears, Jr.
patent: 4226623 (1980-10-01), Koshiyama et al.

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