Method for polishing semiconductor wafer edges

Details Method for polishing semiconductor wafer edges Method for polishing semiconductor wafer edges

1991-06-05

1992-07-07

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437974, 437231, 156645, H01L 2122

Patent

active

051282810

ABSTRACT:
A method for polishing the edges of a plurality of semiconductor wafers rotates a stack of wafers against a polish one or more pads such that both the wafer edges and the sides of the edges are polished to a mirror finish. The polish pad has a series of grooves through which the wafer edges are passed to polish the sides of the wafer edges, or two pads are used, one with grooves and one without grooves.

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patent: 4588473 (1986-05-01), Hisatomi et al.
patent: 4718202 (1988-01-01), Worsham
patent: 4793102 (1988-12-01), Dlouhy
patent: 4864779 (1989-09-01), Ozaki
patent: 4879258 (1989-11-01), Fisher
patent: 4897369 (1990-01-01), Beretta et al.
patent: 4910155 (1990-03-01), Cote et al.

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