Method for polishing semiconductor wafer edges

Details Method for polishing semiconductor wafer edges Method for polishing semiconductor wafer edges

1992-12-11

1994-01-04

Kisliuk, Bruce M.

Abrasive tool making process, material, or composition

With carbohydrate or reaction product thereof

51317, 51322, 51283E, 51 72R, B24B 500

Patent

active

052749592

ABSTRACT:
A system and method for polishing the edges of a plurality of semiconductor wafers rotates a stack of wafers against a polish one or more pads such that both the wafer edges and the sides of the edges are polished to a mirror finish. The polish pad has a series of grooves through which the wafer edges are passed to polish the sides of the wafer edges, or two pads are used, one with grooves and one without grooves.

REFERENCES:
patent: 3699721 (1972-10-01), Beasley
patent: 4344260 (1982-08-01), Ogiwara
patent: 4850147 (1989-07-01), Baker

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