Method for polishing semiconductor substrate and apparatus for t

Details Method for polishing semiconductor substrate and apparatus for t Method for polishing semiconductor substrate and apparatus for t

1995-07-19

1999-05-25

Morgan, Eileen P.

Abrading

Abrading process

Glass or stone abrading

451285, 451287, 451289, 451388, B24B 4106

Patent

active

059065320

ABSTRACT:
The method for polishing a semiconductor substrate includes the steps of (a) forming a flowing liquid layer between a semiconductor substrate and a substrate holder to thereby support the semiconductor substrate therebetween by surface tension of the flowing liquid layer, and (b) compressing the semiconductor substrate onto a polishing cloth including process liquid therein. The method ensures that a semiconductor substrate is not damaged at a reverse surface thereof and also that a semiconductor substrate is not contaminated by particles contained in process liquid, because the flowing liquid layer prevents particles of process liquid from entering between the semiconductor substrate and the substrate holder.

REFERENCES:
patent: 3579916 (1971-05-01), Boettcher
patent: 4466852 (1984-08-01), Beltz et al.
patent: 4519168 (1985-05-01), Cesna
patent: 4521995 (1985-06-01), Sekiya
patent: 4625463 (1986-12-01), Sekiya
patent: 5423716 (1995-06-01), Strasbaugh
European Examination Report under Section 18(3), dated Dec. 9, 1997.

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