Method for polishing a substrate

Details Method for polishing a substrate Method for polishing a substrate

1993-05-03

1995-07-18

Rose, Robert A.

Abrading

Precision device or process - or with condition responsive...

By optical sensor

451 41, 451287, B24B 3704, B24B 4912

Patent

active

054336503

ABSTRACT:
A semiconductor substrate (48) and a block of optical quartz (50) are simultaneously polished. An interferometer (22), in conjunction with a data processing system (16), are then used to monitor the thickness and the polishing rate of the optical quartz block. This allows the endpoint of the polishing process to be automatically and reproducibly detected, and it also allows the polishing rate of the semiconductor substrate (48) to be automatically adjusted during the polishing process.

REFERENCES:
patent: 4199902 (1980-04-01), Sauerland
patent: 4735679 (1988-04-01), Lasky
patent: 4956015 (1989-09-01), Okajima et al.
patent: 5064683 (1990-11-01), Poon et al.
patent: 5081796 (1992-01-01), Scholtz
patent: 5137597 (1992-08-01), Curry, II et al.
patent: 5191738 (1993-03-01), Nakazato et al.
patent: 5302233 (1993-03-01), Kim et al.

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