Method for polishing a silicon wafer using a ceramic polishing s

Details Method for polishing a silicon wafer using a ceramic polishing s Method for polishing a silicon wafer using a ceramic polishing s

1989-06-19

1992-03-17

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437228, 156636, 156645, 156662, 148DIG51, 51281R, 51283R, H01L 2100, H01L 2102, H01L 21304

Patent

active

050968548

ABSTRACT:
The present invention relates to a method for polishing a silicon wafer. The method comprises the steps of: (a) supplying a polishing fluid to a polishing surface, the polishing fluid including an alkaline fluid and polishing particles of high-purity silica dispersed in the alkaline fluid, the polishing surface being planar; (b) bringing a silicon wafer in contact with the polishing surface; and (c) moving at least one of the silicon wafer and the polishing surface relative to the other, thereby polishing the silicon wafer. The method is characterized by the following: the polishing surface is made of a ceramic material harder than the silicon wafer and more resistant to mechanochemical polishing than silicon, and the maximum roughness of the ceramic is less than 0.02 .mu.m.

REFERENCES:
patent: 3342652 (1967-09-01), Reisman
patent: 3841031 (1974-10-01), Walsh
patent: 3874129 (1975-04-01), Deckert et al.
patent: 3915671 (1975-10-01), Kagawa
patent: 4057939 (1977-11-01), Basi
patent: 4598053 (1986-07-01), Yamakawa et al.

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