Abrading – Precision device or process - or with condition responsive... – Computer controlled
Patent
1997-04-24
1999-03-16
Eley, Timothy V.
Abrading
Precision device or process - or with condition responsive...
Computer controlled
451 9, 451 10, 451 11, 451 41, 451 63, 451288, B24B 4904, B24B 5100
Patent
active
058822437
ABSTRACT:
A polishing system (10) is used to polish a semiconductor wafer (16) in accordance with the present invention. Polishing system (10) includes a wafer carrier (14) which includes a modulation unit (20). Modulation unit (20) includes a plurality of capacitors made up of a flexible lower plate (22) and a plurality of smaller upper plate segments (24). A controller (40) monitors the capacitance between each smaller upper plate segment (24) and lower plate (22), and compares the measured capacitance against a predefined set capacitance. To the extent the measured capacitance and predefined capacitance are different, controller (40) adjusts the voltage being applied to the respective upper plate segment (24) so that the measured capacitance and predefined capacitance are aligned. Thus, the present invention is able to achieve dynamic and localized control of the shape of the wafer as it is being polished.
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Adetutu Olubunmi
Bajaj Rajeev
Das Sanjit
Iyer Subramoney
Abel Jeffrey S.
Eley Timothy V.
Goddard Patricia S.
Motorola Inc.
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