Method for polishing a composite comprising an insulator, a meta

Etching a substrate: processes – Nongaseous phase etching of substrate – Using film of etchant between a stationary surface and a...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

438692, 438693, B24B 100

Patent

active

060012692

ABSTRACT:
A process is provided for polishing a composite comprised of an insulating layer, a metal and titanium in which the composite is polished in a standard polishing machine using an aqueous slurry comprising submicron abrasive particles, an iodate, and a peroxide. Another process is provided in which peroxide is added to the aqueous slurry only when a titanium or titanium nitride layer is being polished. Further the invention also comprises the addition of a base to the slurry stream exiting the polishing machine to bring the pH of the used slurry to about 7 or higher.

REFERENCES:
patent: 5391258 (1995-02-01), Brancaleoni et al.
patent: 5476606 (1995-12-01), Branacaleoni et al.
patent: 5527423 (1996-06-01), Neville et al.
Rutten et al., "Pattern Density Effects in Tungsten CMP", Jun. 27-29, 1995 VMIC Conf., ISMIC-104/95/0491, 1995.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for polishing a composite comprising an insulator, a meta does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for polishing a composite comprising an insulator, a meta, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for polishing a composite comprising an insulator, a meta will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-859957

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.