Etching a substrate: processes – Nongaseous phase etching of substrate – Using film of etchant between a stationary surface and a...
Patent
1997-05-20
1999-12-14
Breneman, Bruce
Etching a substrate: processes
Nongaseous phase etching of substrate
Using film of etchant between a stationary surface and a...
438692, 438693, B24B 100
Patent
active
060012692
ABSTRACT:
A process is provided for polishing a composite comprised of an insulating layer, a metal and titanium in which the composite is polished in a standard polishing machine using an aqueous slurry comprising submicron abrasive particles, an iodate, and a peroxide. Another process is provided in which peroxide is added to the aqueous slurry only when a titanium or titanium nitride layer is being polished. Further the invention also comprises the addition of a base to the slurry stream exiting the polishing machine to bring the pH of the used slurry to about 7 or higher.
REFERENCES:
patent: 5391258 (1995-02-01), Brancaleoni et al.
patent: 5476606 (1995-12-01), Branacaleoni et al.
patent: 5527423 (1996-06-01), Neville et al.
Rutten et al., "Pattern Density Effects in Tungsten CMP", Jun. 27-29, 1995 VMIC Conf., ISMIC-104/95/0491, 1995.
Cook Lee Melbourne
Sethuraman Anantha R.
Wang Huey-Ming
Wu Guangwei
Ahmed Shamim
Benson Kenneth A.
Breneman Bruce
Kaeding Konrad H.
Rodel Inc.
LandOfFree
Method for polishing a composite comprising an insulator, a meta does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for polishing a composite comprising an insulator, a meta, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for polishing a composite comprising an insulator, a meta will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-859957