Method for plating palladium

Details Method for plating palladium Method for plating palladium

1990-07-16

1992-09-22

Valentine, Donald R.

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Treating substrate prior to coating

205212, 205265, C25D 534

Patent

active

051494205

ABSTRACT:
A method for plating palladium on Group IV-B and V-B metals, particularly niobium, vanadium, zirconium, titanium and tantalum as pure metals and as alloys is described. The method provides the metal to be plated with a roughened exposed surface to be plated which has been electrolytically hydrided and then the surface is plated using electroless or electrolytic plating. Hydride is removed from the plated surface, usually by heating. This also removes other surface impurities and aids the coat adhesion. The resulting palladium plated metal articles are usful for hydrogen extraction.

REFERENCES:
patent: 3350846 (1967-11-01), Makrides
patent: 3725219 (1973-04-01), Wesoloski
patent: 4240878 (1980-12-01), Carter
patent: 4486274 (1984-12-01), Abys et al.
patent: 4715935 (1987-12-01), Lovie et al.
patent: 4755265 (1988-07-01), Young
Boes, N., et al., Z. Naturforsch. 31 A, 754-759 (1976).
Pick, M. A., The Kinetics of Hydrogen Adsorption-desorption by Metals, G. Bombakidis ed. Proceeding of NATO Advanced Study Inst. on Metal Hydrides, Jun. 17-27, Rhodes, Greece (Plenum Press) pp. 329-343 (1981).
Hsu and Buxbaum, J. Electrochemical Soc. 132 2419-2420 (1985).

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