Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Depositing predominantly alloy coating
Reexamination Certificate
2005-06-28
2005-06-28
Wong, Edna (Department: 1753)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Depositing predominantly alloy coating
C205S300000, C205S301000, C205S302000
Reexamination Certificate
active
06911138
ABSTRACT:
A method for plating electrodes of ceramic chip electronic components includes performing electroplating in a plating bath. The plating bath contains tin (II) sulfamate, acting as a tin (II) salt; a complexing agent including at least one selected from the group consisting of citric acid, gluconic acid, pyrophosphoric acid, heptoic acid, malonic acid, malic acid, salts of these acids, and gluconic lactone; and a brightener including at least one surfactant having an HLB value of about 10 or more. The tin plating adhesion of the resulting ceramic chip electronic components can be limited to a certain level.
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Copy of Japanese Examination Report dated Aug. 10, 2004 (and English translation of same).
Hamada Kunihiko
Higuchi Shoichi
Motoki Akihiro
Takano Yoshihiko
Dickstein Shapiro Morin & Oshinsky LLP.
Murata Manufacturing Co. Ltd.
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