Chemistry: electrical and wave energy – Processes and products
Patent
1984-07-24
1986-06-03
Lawrence, Evan K.
Chemistry: electrical and wave energy
Processes and products
204 30, 427259, 427290, 427306, C25D 556, B05D 310, B05D 312
Patent
active
045928088
ABSTRACT:
A method for plating conductive plastics. The area to be plated is abrasively blasted as necessary to produce suitable mechanical bonding sites. The area is cleaned with a hot alkaline cleaning solution that will not appreciably attack the plastic. The area is sensitized to provide a base for firm adhesion of the metal onto the plastic. Sensitizing a graphite-reinforced epoxy composite preferably includes flowing a dilute solution of hydrochloric acid over the area, flowing a palladium chloride catalyst, rinsing the area, flowing a stannous accelerator, and rinsing the area again. Striking is then carried out by flowing an electroless plating solution over the area to provide a preliminary deposit of metal. The electroless solution may be either copper or nickel. The flowing of each solution is done at a very low velocity to ensure effective and even action on the entire area. Following striking, a plating buildup is provided as required. The plating buildup may be accomplished by continuing the electroless plating process, immersing the area and carrying out electrolytic plating, or brush plating the area. Whatever plating method is chosen, steps must be taken to protect against overheating of the conductive plastic.
REFERENCES:
patent: 3093509 (1963-06-01), Wein
patent: 3438226 (1969-04-01), Dalpiaz
patent: 3671285 (1972-05-01), Prescott
patent: 4038042 (1977-07-01), Adelman
patent: 4159934 (1979-07-01), Kadija
patent: 4264646 (1981-04-01), Thornburg et al.
patent: 4353933 (1982-10-01), Araki et al.
"ABS Joins Plastics That Can Be Plated", from the Mar. 1963 issue of C & EN, pp. 48-49.
Lawrence Evan K.
Pauly Joan H.
The Boeing Company
LandOfFree
Method for plating conductive plastics does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for plating conductive plastics, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for plating conductive plastics will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1231464