Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Depositing predominantly single metal coating
Patent
1992-05-11
1993-11-30
Tufariello, T. M.
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Depositing predominantly single metal coating
C25D 348
Patent
active
052661830
ABSTRACT:
A method for making an x-ray mask having a low-stress absorber layer. A substrate is placed in an electroplating system and an electroplating solution is provided to the electroplating system. The electroplating solution has a gold sulfite based component and a thallium based component. The thallium based component is at a concentration of at least 20 milligrams per liter of electroplating solution. A gold containing absorber layer is electrodeposited onto the substrate. A high concentration of thallium produces an absorber layer insensitive to the brightener concentration in the electroplating solution and having a stress less than approximately 1.times.10.sup.8 dynes/cm.sup.2. In addition, the absorber has a small grain size, a low surface roughness, and a low defect density. Thus, the absorber layer is easier to inspect and, if required, to repair.
REFERENCES:
Shih-Liang Chiu et al., "Electrodeposition of low stress gold for x-ray mask", J. Vac. Sci. Technol. B8 (6), Nov./Dec. 1990.
G. E. Georgiou et al., "DC electroplating of sub-micron gold patterns on X-ray masks", SPIE vol. 471 Electron-Beam, X-Ray, and Ion-Beam Techniques for Submicrometer Lithographies III (1984).
W. Chu et al., "Low-stress gold electroplating for X-ray masks", Microcircuit Engineering 91 International Conference on Microlighography, Rome, Italy, 17-19 Sep. 1991 (Poster P1.20).
K. Suzuki et al., "High flatness mask for step and repeat x-ray lithography", J. Vac. Sci. Technol. B4 (1), Jan.Feb. 1986.
Dauksher William J.
Resnick Douglas J.
Barbee Joe E.
Dover Rennie William
Motorola Inc.
Tufariello T. M.
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