Method for plasma etching to manufacture electrical devices...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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C029S610100, C029S830000, C029S852000, C337S290000, C338S0220SD, C216S067000

Reexamination Certificate

active

10227887

ABSTRACT:
Methods of manufacturing a variety of circuit protection devices are provided as well as devices so manufactured. In an embodiment, a surface mount electrical device having a substrate and a pair of conductive electrodes connected to an electrical protection component for sensing current or voltage is provided. The method includes the steps of: (i) providing a substrate having a first surface and a second surface; creating a first and second aperture, plasma etching a through-hole, slot or bore through the substrate; (ii) depositing a conductive material on the substrate and through the apertures to form the electrodes, wherein the conductive material extends through the apertures and on the first and second surfaces of the substrate, respectively; and (iii) depositing the electrical protection component on the first surface of the substrate to electrically connect the electrodes.

REFERENCES:
patent: 4654115 (1987-03-01), Egitto et al.
patent: 4786888 (1988-11-01), Yoneda et al.
patent: 5653893 (1997-08-01), Berg
patent: 5729897 (1998-03-01), Schmidt et al.
patent: 5790008 (1998-08-01), Blecha et al.
patent: 5907272 (1999-05-01), McGuire
patent: 6040755 (2000-03-01), Abe et al.
patent: 6392528 (2002-05-01), Myong
patent: 6559486 (2003-05-01), Ueda
patent: 6640420 (2003-11-01), Hetherton et al.
patent: 6642150 (2003-11-01), Huang et al.
patent: 6838388 (2005-01-01), Tadokoro et al.
patent: 6838972 (2005-01-01), Minervini et al.
Article entitled “Plasma Etching and Desmearing of Through Holes in the PWB Industry” published by Advanced Plasma Systems, Inc., 1995.
Article entitled “Low Cost Through-hole Activation Method for PTFE Based Substrates” written by Carlos Burton, Robert Daigle, and Stephen Kosto and published by Advanced Plasma Systems, Inc., 1995.
Advanced Plasma Systems, Inc. “PWB-Series Technical Data” Advertisement, undated.
Advanced Plasma Systems Inc. “Now You Can Achieve the Ultimate Quality For Your Printed Wire Boards” Advertisement, undated.
Advanced Plasma Systems, Inc. brochure “Advanced Technology For The Printed Wire Board Industry,” undated.
Advanced Plasma Systems, Inc. Company Brochure, undated.

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